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工業技術研究院

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技術名稱: 離型取下技術

技術簡介

自動化設備取下面板級扇出型封裝FOPLP之RDL結構,阻值變化率≦10%,取下良率80%

Abstract

Through de-bonding simulation, we had established the de-bonding technology for single carrier and double carriers, and also established automatic de-bonding facility. This technology and facility can be used for de-bonding of flexible electroinc devices.

技術規格

自動化設備取下面板級扇出型封裝FOPLP之RDL結構,阻值變化率≦10%,取下良率80%。

Technical Specification

none

技術特色

自動化設備取下面板級扇出型封裝FOPLP之RDL結構,阻值變化率≦10%,取下良率80%

應用範圍

IOT裝置、高效能伺服器等之面板

接受技術者具備基礎建議(設備)

面板生產相關設備與應力模擬設備

接受技術者具備基礎建議(專業)

none

技術分類 製程

聯絡資訊

聯絡人:李裕正 面板級製程應用技術組

電話:03-5918395 或 Email:YZLee@itri.org.tw

客服專線:+886-800-45-8899

傳真:03-5820046

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