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工業技術研究院

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技術名稱: 智慧功率模組與次系統設計、製造與測試技術

技術簡介

傳統風扇馬達趨控模組目前都是採用獨立式晶片封裝架構(discrete device),為了提高系統性能與縮小系統板尺寸,目前廠商均朝向整合異質晶片之模組封裝架構.本計畫提出整合功率晶片(MOSFET)/驅動晶片(Gate driver)/控制晶片(MCU)之智慧型功率模組, 取代現有獨立式封裝元件,降低雜散訊號,提高模組性能.

Abstract

All in one power module and sub-system design / assembly and testing technology

技術規格

1.模組規格: 600V/4A. 2.模組結合MOSFET/Gate driver/MCU. 3.模組散熱能力: Rthja 29K/W.

Technical Specification

In the tranditional control power module for FCU motor application was combined the power chip / Gate driver and MCU discrete device. In order to improve the efficiency and reduce size for sub-system , the FCU motor maker need the intelligent power module. Therefore, we have developed integration the power chip / gate driver and MCU chip in one package structure, it can improve the sub-system efficiency.

技術特色

此模組與次系統技術主要整合功率晶片/控制晶片與趨動晶片,取代discrete元件,透過縮短元件間的導線距離,提高元件性能.

應用範圍

馬達驅動應用

接受技術者具備基礎建議(設備)

none

接受技術者具備基礎建議(專業)

電子、電機、資訊、機械等工程背景、具C語言程式設計能力。

技術分類 通訊與光電

聯絡資訊

聯絡人:王欽宏 構裝技術組

電話:12225 或 Email:Jerry_Wang@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820412

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