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工業技術研究院

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技術名稱: 融合感知系統設計與異質整合封裝技術

技術簡介

本技術使用無焊錫接點透過覆晶構裝的方式進行高密度晶片組裝,且可應用於晶片對晶圓的組裝製程,因為無焊錫接點可以省略凸塊製程的成本但仍具有高可靠度的電性接點。

Abstract

A solderless interconneciton is developedbe and could be applied to high density packaging technology. Main assembly process is chip on wafer (CoW) bonding with flip-chip bonding method. It could have lower cost and high reliable interconnection without bumping process.

技術規格

1.適用於6""~ 12"" CoW bonding process 2. Bonding temperature ?300°C

Technical Specification

none

技術特色

none

應用範圍

高階影像感測器的多晶片異質整合封裝

接受技術者具備基礎建議(設備)

1. 高精度CoW組裝設備 2. 高潔淨切割設備 3. 高潔淨表面清潔設備 4. 高潔淨無塵室(class 100)

接受技術者具備基礎建議(專業)

電子構裝、機械、物理、化學等工程背景製程使用經驗與能力。

技術分類 通訊與光電

聯絡資訊

聯絡人:王欽宏 企畫與推廣組

電話:12225 或 Email:Jerry_Wang@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820412

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