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工業技術研究院

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技術名稱: 高解析重分佈線路技術

技術簡介

利用面板級製程,開發高解析重分佈線路(RDL)結構與製程並搭配無光罩圖案化技術(Maskless) 與大面積電鍍銅製程技術,可實現共四層堆疊之高解析重分佈線路

Abstract

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技術規格

導線最細線寬:1.2 μm / 製程溫度< 300C/ 重分佈層數: 4層 (含UBM)/ 基板尺寸: 370*470 mm2

Technical Specification

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技術特色

1. 製程相容於面板廠TFT Array 量產設備 2. 利用無光罩曝光技術可快速驗證設計

應用範圍

高階晶片(高I/O數)

接受技術者具備基礎建議(設備)

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接受技術者具備基礎建議(專業)

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技術分類 製程

聯絡資訊

聯絡人:李裕正 面板級製程應用技術組

電話:+886-3-5918395 或 Email:YZLee@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820046

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