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工業技術研究院

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技術名稱: 超快雷射多層複材微切割技術

技術簡介

建立多層硬脆材料基板的精密切割系統,包含超快雷射波長轉換模組,藉由將常用雷射的波長(1064 nm)轉換成多層材料之共同透明區,使超快雷射穿透光路徑間的所有材料層,同步改質各層材料的改質切割。

Abstract

A precision cutting system is developed for multilayer hard and brittle material substrates, including an ultrafast laser wavelength conversion module. By converting the wavelength of widely-used ultrafast laser (1064 nm) to common transparent zone of multilayer materials, the laser beam penetrates all the materials layers and modifies the respective layers simultaneously to finish cutting process .

技術規格

(a)波長轉換模組:轉換波長1550 nm (b)應用材料:多層複合材料(SioG, Si on glass) (c)切割面粗糙度Ra<1 μm

Technical Specification

.

技術特色

超快雷射的時脈調整技術,可控制時脈之時間差與強弱比例,將材料預離子化,提升吸收效率及降低熱效應,提升切割面的平整度。波長轉換技術使超快雷射波長切換至多層材料之共同透明區,使超快雷射穿透光路徑間的所有材料層,直接切斷多層材料。加工端之光學模組,可選用線型光束模組或聚焦鏡組,用以單道次切割不同厚度的多層基板。

應用範圍

感測器切割 Si-on-Glass切割

接受技術者具備基礎建議(設備)

超快雷射源 波長轉換模組 聚焦鏡組 精密線性平台

接受技術者具備基礎建議(專業)

光學、雷射製程、機械

技術分類 機械與系統

聯絡資訊

聯絡人:廖經理 M100

電話:06-6939109 或 Email:artliao@itri.org.tw

客服專線:+886-800-45-8899

傳真:none

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