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工業技術研究院

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技術名稱: 加成式細微導線製造技術

技術簡介

本技術整合凹版轉印技術及其關鍵組件(塗料、模具等),使可經由印刷、UV活化及金屬化等三道製程直接在基板上印製超細導線,其電性相近於純金屬。

Abstract

This study has developed a manufacture process of printing fine-line pattern, activatiing precursor and metalization to form a circuit with <3um linewidth circuit on a substrate. The conductivity is at the same level with pure copper.

技術規格

轉印幅寬≧500mm、線路線寬≦3μm。

Technical Specification

none

技術特色

觸控元件、軟性印刷電路板及光電元件線路等細微線路製作。

應用範圍

觸控元件、軟性印刷電路板及光電元件線路等細微線路製作。

接受技術者具備基礎建議(設備)

機械、材料、化學基礎知識

接受技術者具備基礎建議(專業)

印刷技術、轉印塗料特性

技術分類 光電與半導體製程設備

聯絡資訊

聯絡人:王裕銘 先進製造技術組(0M000)

電話:+886-3-5912412 或 Email:ymwang@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820043

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