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工業技術研究院

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技術名稱: 雷射精微與異形錐體鑽孔技術

技術簡介

完成之雷射精微與異形錐體鑽孔技術,其中雷射自旋與偏擺模組可整合多軸光路系統,進行不同鑽孔孔徑與錐度的調變,可滿足不同製程所需的孔徑與錐度需求,並搭配雷射振鏡控制平台實現四維加工鑽孔技術。

Abstract

The precision laser trepanning and taper drilling techno-logy is completed in this year. The laser axis spin and shift module can adjust the trepanning via diameter and taper angle through the multi-axis system and composite optical architecture to meet the needs of the via diameter and taper angle required by different manufacturing processes and integrate with the laser galvanometer control platform to achieve four-dimensional precision laser trepanning and processing technology.

技術規格

鑽孔孔徑? 50μm 鑽孔錐度≧±3°

Technical Specification

Via Diameter : ? 50μm Taper Angle :≧±3°

技術特色

在五軸雷射精微加工製程中,需要使光軸自旋與偏移,動態地改變雷射旋轉繞孔孔徑與光束入射的角度,提昇雷射加工的成效。雷射精微與異形錐體鑽孔技術,提供業者從原本3D平面雷射打洞升級為4D雷射精微鑽孔,其中開發之雷射自旋與偏擺機電模組與國際指標大廠LPKF提供的解決方案相比,藉由技術自主化的優勢將能有效降低30%以上之開發成本,以及鑽孔精度提升20%。

應用範圍

雷射加工產業、精密機械產業

接受技術者具備基礎建議(設備)

工業電腦、雷射振鏡、雷射振鏡控制開發平台

接受技術者具備基礎建議(專業)

需具備有雷射振鏡控制技術之開發人員

技術分類 精密機械

聯絡資訊

聯絡人:陳文泉 控制核心技術組(0E000)

電話:+886-3-5918624 或 Email:JasonChen@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5826594

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