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工業技術研究院

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技術名稱: 雷射3D 輪廓量測技術

技術簡介

以雷射掃描感測為核心技術,開發雷射高速打點與取樣,以及3D輪廓點雲演算技術,進行工件3D尺寸與公差的量測,提供產線上多樣化零組件的品質量測與管理,並輕鬆連結數位化的生產管理系統,可協助國內加工業者整合前端的製造設備與終端全自動化的品質量測系統。

Abstract

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技術規格

■掃描取樣速度 ≧ 750 lines/sec ■深度量測重覆精度 ≦± 0.002 mm

Technical Specification

none

技術特色

非接觸式的3D雷射掃描進行全區域多點量測,可高速擷取物體表面輪廓,實現形狀、方向、定位、偏轉度等快速3D量測。

應用範圍

航太零件、汽機車零組件、3C產品、曲面螢幕等產品

接受技術者具備基礎建議(設備)

電腦程式設計、電路設計

接受技術者具備基礎建議(專業)

需具備點運動學知識、點雲運算知識以及量測知識

技術分類 精密機械與控制器

聯絡資訊

聯絡人:陳國彰 智慧微系統科技中心

電話:47136 或 Email:kerwin_c@itri.org.tw

客服專線:+886-800-45-8899

傳真:none

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