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工業技術研究院

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技術名稱: 超快雷射TGV鑽孔技術

技術簡介

TGV雷射玻璃鑽孔製程是透過雷射改質搭配濕式製程達成高產速鑽孔需求,以雷射中心最新研發之高均質長景深光路模組,可在50 μm至1200 μm玻璃厚度下達成高真圓度TGV製程。

Abstract

Through glass via (TGV) process have more advantage than through silicon via (TSV). In addition, acknowledge for fabricating TGV is indispensable for the needing of transparent substrate based on Micro LED. In high aspect ratio TGV process, glass substrate will be modified by laser irradiation to increase the etching selectivity rate between the irradiated zone and untreated zone.

技術規格

Via diameter 10~80 μm Tape angle > 85度 Roundness >95% Glass thickness 50μm~1200μm Aspect ratio >10

Technical Specification

"Via diameter 10~80 μm Tape angle > 85度 Roundness >95% Glass thickness 50μm~1200μm Aspect ratio >10"

技術特色

TGV雷射玻璃鑽孔製程是透過雷射改質搭配濕式製程達成高產速鑽孔需求,以雷射中心最新研發之高均質長景深光路模組,可在50 μm至1200 μm玻璃厚度下達成高真圓度TGV製程。

應用範圍

"1.Glass interposer 2.3D-IC package 3.CSP 4.microLED"

接受技術者具備基礎建議(設備)

超快雷射源, 精密線性平台

接受技術者具備基礎建議(專業)

光學、製程、材料、機械、光機電整合

技術分類 機械與系統

聯絡資訊

聯絡人:黃建融 L100

電話:+886-6-6939007 或 Email:ChienJungHuang@itri.org.tw

客服專線:+886-800-45-8899

傳真:none

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