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工業技術研究院

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技術名稱: 雷射細微鑽孔技術

技術簡介

開發高數值孔徑NA(Numerical aperture)之光學掃描鏡組,以符合大範圍、高真圓度與細微孔徑的需求,並將掃描鏡組與光束整型結合,調控在平頂光路與鈍化高斯光斑上之光型分布,強化雷射精微鑽孔能力與品質。

Abstract

Develop high numerical aperture optical scanner to fulfill large range, high roundness and fine diameter applications. Combining scanner optics and beam shaping techniques, it is expected to manipulate a flat-top distribution thus passivate the Gaussian beam shape, therefore capable of strengthening the ability and quality of laser fine drilling.

技術規格

(a)細微加工孔徑:≦10 μm@真圓度90%,孔深≧15 μm (b)高NA光學掃描鏡組:掃描範圍50 * 50 mm2@光斑尺寸≦10 μm

Technical Specification

(a)細微加工孔徑:≦10 μm@真圓度90%,孔深≧15 μm (b)高NA光學掃描鏡組:掃描範圍50 * 50 mm2@光斑尺寸≦10 μm

技術特色

本技術建立關鍵光學模組(高NA光學掃描鏡組及雷射鈍化平頂的光束整形),光斑尺寸可小至5.1 μm,加工速度達1204 point/s;同時建立軟硬基板的微細鑽孔技術,鑽孔直徑可達6.9 μm,真圓度達90%。建立的技術規格與國際領導廠商ESI(美)及Mitsubishi(日)相當,可解決PCB產業面對新世代製程技術的10 μm ~30 μm微鑽孔需求。

應用範圍

PCB軟硬載板鑽孔

接受技術者具備基礎建議(設備)

超快雷射源, 精密線性平台

接受技術者具備基礎建議(專業)

光學、製程、材料、機械、光機電整合

技術分類 FY105-先進製造應用

聯絡資訊

聯絡人:林于中 L100

電話:+886-6-6939280 或 Email:linyc@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-6-6939056

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