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工業技術研究院

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技術名稱: 氣噴印圖案化技術

技術簡介

透過流場設計、霧化顆粒選別與環形氣流裝置使得霧化之膠體可進行自主聚焦,整合可誘發金屬化之低黏度膠體,使膠體霧化氣流聚焦後透過噴嘴可於基板上形成寬度<50 um之圖案化線路,有別與一般噴印技術因微小之霧化膠體可形成筆直之細微導線,解決一般噴印技術之線路葫蘆狀之問題,可應用於線路修補、快速電路打樣與2D/3D線路製作。

Abstract

Through the design of the flow field, the selection of the atomized particles and the annular airflow device, the atomized colloid can be focused autonomously, and the low viscosity colloid that can induce metallization is integrated. After focusing the colloidal atomized airflow, the line can be formed 50 um width on the substrate through the nozzle. The patterned circuit of um is different from the ordinary spray printing technology because the tiny atomized colloid can form straight and fine wires. It solves the problem of the gourd shape of the general spray printing technology. It can be used for circuit repair, rapid circuit proofing and 2D / 3D circuit production.

技術規格

最小線寬<50 um

Technical Specification

-

技術特色

用於印刷電子、電路板修補產業,透過流場設計、霧化顆粒選別與環形氣流裝置使得霧化之膠體可進行自主聚焦,整合可誘發金屬化之低黏度膠體,使膠體霧化氣流聚焦後透過噴嘴可於基板上形成寬度<50 um之圖案化線路,有別與一般噴印技術因微小之霧化膠體可形成筆直之細微導線,解決一般噴印技術之線路葫蘆狀之問題,可應用於線路修補、快速電路打樣與2D/3D線路製作。

應用範圍

電子產業

接受技術者具備基礎建議(設備)

霧化器模組、噴印設備

接受技術者具備基礎建議(專業)

機械、化學、材料

技術分類 精密機械

聯絡資訊

聯絡人:林義暐 先進製造技術組

電話:+886-3-5916479 或 Email:YiWeiLin@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820043

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