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工業技術研究院

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技術名稱: 微細電路之缺陷自主分類技術

技術簡介

開發軟性電路板微細電路缺陷分類技術,針對傳統電路板產業僅能辨識≧30um線寬硬板進行技術提升,克服軟板性形變及毛屑、粉塵之影響,經由影像重繪技術,針對10±2um微細電路進行斷路、短路及正常微細電路的缺陷分類。

Abstract

To meet the damand of rechecking defect in PCB production line, we developed the technology of defect identification in fine-line circuit(10±2um) to improve the cability of identifying fine-line in various substrate materials .This techology developed the method to overcome the issues of distortion and particlae in flexible printed circuit board with fine-line circuit . The accuracy was achieved 97% for identifying two diffenet defects by the sub-technology of redraw image and hybrid algorithm.

技術規格

1.最小可辨識線寬≦10μm. 2.對位精度±3um. 3.辨識準確度:≧97%. 4.辨識兩種以上缺陷結構.

Technical Specification

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技術特色

可應用於各式電路板缺陷辨識,開發軟性電路板微細電路缺陷分類技術,針對傳統電路板產業僅能辨識≧30um線寬硬板進行技術提升,克服軟板性形變及毛屑、粉塵之影響,經由影像重繪技術,針對10±2um微細電路進行斷路、短路及正常微細電路的缺陷分類。

應用範圍

可應用於各式電路板缺陷辨識

接受技術者具備基礎建議(設備)

AI運算主機,AOI設備,複檢機

接受技術者具備基礎建議(專業)

機械、資通

技術分類 精密機械

聯絡資訊

聯絡人:連健宏 先進製造技術組

電話:+886-3-5912193 或 Email:stevenlien@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820043

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