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工業技術研究院

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技術名稱: 基板內藏元件整合設計與模型庫技術

技術簡介

以傳統有機基板壓合技術,壓合高介電係數基板(Hi-Dk, Dk>36@6.0GHz)與有機基板(FR4,FR5等),開發射頻(6GHz)內藏被動元件基板結構設計技術,包括基板內藏電容、基板內藏電感元件結構、內藏被動元件及寄生元件模型(Modeling)、元件程式庫(Library)、基板材料射頻電性評估與量測驗證。

Abstract

The RF integral substrate packaging and Modeling technology develops embedded passives of substrate that laminated by special materials with high dielectric constant and organic fiber glass substrates. It includes of the research of newly high dielectric constant materials, developing novel lamination process technology, RF embedded passives design, analysis of electricity and thermal conductivity, simulation, measurement and verification and model extraction, etc. Furthermore, the RF integral substrate packaging technology expects to achieve the goal of replacing and reducing the number of traditional discrete elements, minimizing the packaging size of electronic products and rising electrical performance of package.

技術規格

. 工作頻段:2.4GHz . 新材料(εr≧38; embedded into BT or other Substrate)與壓合製程驗證. . 2.4GHz 內藏被動元件的射頻模組為載具之設計量 測驗證 . . 內藏被動元件高頻模型與模型程式庫建立.

Technical Specification

.Frequency!G2.4GHz .Laminating and verifying Hi-Dk material(¢G`r !U38@2.4GHz; embedded into BT or other Substrate) .Design the 2.4GHz embedded passives RF module for test vehicle .Develop the embedded passives modeling and library for RF mo

技術特色

基板內藏被動元件可以取代傳統SMD元件,縮減基板表面空間,市場上具有龐大的商業潛力,依據市場知名市調公司PRISMARK預估,西元2006年內藏被動元件需求約佔整體被動元件10%以上,商機需求逐年擴增;且係通訊產品高密度封裝整合之一有效技術及必然趨勢。應用傳統PCB整合高介電係數基板來內藏被動元件,可以達到在同一基板上整合一般射頻模組及數位系統,增加構裝密度,可提昇傳統PCB之附加價值與競爭力。

應用範圍

基板材料業、電路板製造業、電子構裝業、系統組裝業和通訊系統業...等

接受技術者具備基礎建議(設備)

1. 個人電腦(CPU:1GHz以上;RAM:256MB以上) 2. 高頻高階電磁模擬軟體(如:Sonnet 或 HFSS…) 3. 高頻網路分析儀(6GHz以上,如:Agilent 8510C) 4. 晶圓級量測平台(6吋以上,probe station)

接受技術者具備基礎建議(專業)

1. 電子電路學 2. 電磁學 3. 高頻微波電路

技術分類 系統

聯絡資訊

聯絡人:陳文峰 企畫與推廣組

電話:+886-3-5913314 或 Email:lindaliou@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820412

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