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Industrial Technology Research Institute

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Electronic and Optoelectronic System Research Laboratories

Fan-Out Panel Level Packaging
Fan-Out Panel Level Packaging

In response to the large-scale production and high cost-effectiveness packaging need for automotive and AI high-speed computing chips, ITRI has developed fan-out panel level packaging that features low-warpage multi-layer RDL and large-sized high-uniformity copper electroplating technologies...

High-Speed Broadband Analog Front-End IC Technology
High-Speed Broadband Analog Front-End IC Technology

Information and Communications Research Laboratories cooperates with domestic companies which have capability of measurement equipment and high-precision testing equipment to develop broadband...

High-Bandwidth AI Chip and System Solutions
High-Bandwidth AI Chip and System Solutions

In this world of AI with diverse applications and specifications, highly adaptable solutions are required for flexible product development...

Heterogeneous Integration With Through-Silicon Via Technology
Heterogeneous Integration With Through-Silicon Via Technology

The through-silicon via (TSV) process is a key technology for 3D chip stacking, providing the shortest vertical interconnection path to replace traditional wire bonding...

Specialized Knowledge Large Language Model Technology
Specialized Knowledge Large Language Model Technology

We propose an advanced solution for fine-tuning specialized knowledge language models, which will fundamentally change the way you handle data and enhance model training efficiency...

AI SoC System Software
AI SoC System Software

The software solutions for the AI chip design contain (1) static performance analysis technology, (2) full-system virtual platform and (3) compiler optimization...

Light-Field Three-Dimensional Imaging Technology
Light-Field Three-Dimensional Imaging Technology

The system reconstructs complete three-dimensional light-field information in real space using light-field imaging and ray-direction reconstruction...

Compound Semiconductor Device Modularization and Innovative System Applications
Compound Semiconductor Device Modularization and Innovative System Applications

ITRI is committed to delivering highly integrated technology solutions, with a focus on power conversion and energy storage systems for electric vehicles (EVs) and large-scale renewable energy applications...

Optical Transmission-Silicon Photonic Integrated Technology
Optical Transmission-Silicon Photonic Integrated Technology

Optical Transmission–Silicon Photonic Integrated Technology combines high-speed optoelectronic measurement, heterogeneous integration, Micro LED interconnect validation, and fiber-optic packaging to support next-generation high-speed, low-power optical transceivers for AI, 5G, and data communications...

3D High Accuracy and High Precision Measurement System
3D High Accuracy and High Precision Measurement System

The combination of 2D image and 3D model analysis technologies is applied for high accuracy and high precision measurements on objects with curvature surfaces...