This simulation technology takes multiple physical factors (electric field, flow field, mass transfer, substrate patterning) into account. It affords the optimization of electroplating process parameters and predicts the thickness uniformity of plated copper film. In the past, the electroplating process depends on operating experience to obtain the best result. However, our approach is based on theoretical basis for model establishment, and then provides suggestions for process improvement and failure mode comparison. The simulation technology can improve process, materials and equipment more efficiently.
Applications & Benefits
Simulation technology of electroplating process can help manufacturers, including material, equipment and process development, shorten R&D verification time to enter the semiconductor packaging manufacturing field.