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Industrial Technology Research Institute

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Advanced Inspection and Metrology Technologies for Semiconductor Manufacturing

Technology Overview

Advanced Inspection and Metrology Technologies for Semiconductor Manufacturing.
Advanced Inspection and Metrology Technologies for Semiconductor Manufacturing.

With the miniaturization of electronic devices, the manufacturing process of semiconductor products requires advanced equipment to meet measurement challenges. ITRI has developed a series of advanced inspection and measurement technologies to provide metrology solutions for industry. The mono-droplet generator (MDG) and element reference standard were established to generate a particle standard for particle size calibration of Single Particle Inductively Coupled Plasma Mass Spectrometry (spICPMS). The metrology solutions meet the calibration requirements of particle sizes and number concentrations for related raw materials used in semiconductors. For Die Attach Film (DAF), ITRI has developed a film thickness and wafer thickness measurement technology. It breaks the limitation of DAF thickness measurement and offers good accuracy regardless of DAF thickness.

Applications & Benefits

The three-dimension profile measurement technology is capable of alignment inspection for the stacking modules of integrated circuits with heterogeneous integration. The accuracy has been improved from 100 nm to 10 nm, greatly enhancing the competitiveness of manufacturers of automated wafer size measurement equipment.