Technology Overview
Fan-Out Panel Level Packaging
In response to the large-scale production and high cost-effectiveness packaging need for automotive and AI high-speed computing chips, ITRI has developed fan-out panel level packaging that features low-warpage multi-layer RDL and large-sized high-uniformity copper electroplating technologies. This innovation can turn a 3.5-generation panel production line into one for semiconductor fan-out packaging, thereby revitalizing panel production lines that are no longer cost-effective. Moreover, it enables the use of 70% of existing facilities and equipment.
Applications & Benefits
At the same time, it drives the transformation of related panel equipment and material supply chains, increasing industrial value nearly ten times.