Technology Overview
Panel-Level Fan-Out Module Integration Technology.
Based on the size and process framework of current IC carriers, ITRI’s Panel-level Fan-out Module Integration Technology features cross-field integration of the panel-level fan-out packaging design and process. Besides upgrading the IC carrier industry, the technology makes it possible to embed 2 μm fine conduction lines in IC carriers for the PCB industry. Furthermore, a testing platform for materials and processing is established using ITRI’s fan-out packaging design and process technology.
Applications & Benefits
Currently adopted by manufacturers at home and abroad, this platform prepares IC carrier factories for offering packaging services to clients and allows material manufacturers to carry out packaging testing on fan-out packaging materials.