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Industrial Technology Research Institute

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Embedded Interposer Carrier Substrate

Technology Overview

In response to the continuous demand for functional integration of electronic products, lightweighting and thinning of mobile communication devices, ITRI has developed a fine pitch heterogeneous carrier technology integrated with interposer. The thinning fine pitch interposer is embedded into existing IC carriers through bump-free interconnection and create an innovative IC heterogeneous integrated carrier architecture (EMI, Embedded interposer carrier) to achieve the next generation of high-grade 2.5D or 3DIC module thinning and reliability enhancement, and has already cooperated with manufacturers to develop technology for trial production.

Key Points

We has several U.S. patents of EIC. In terms of assembly, this technology uses non-conductive film bonding, and the peak temperature can be reduced to less than 250°C. The advantages of the overall packaging structure include reducing the 2.5D package thickness by more than 50%, and achieving the target of 2μm/2μm line width/spacing.

Applications & Benefits

Bumpless interconnecting technology can be applied to high performance chips with high density connections, and to copper-to-copper bonding technology for better reliability.

Embedded Interposer Carrier Substrate
Embedded Interposer Carrier Substrate.
Embedded Interposer Carrier Substrate
Embedded Interposer Carrier Substrate.
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