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Industrial Technology Research Institute

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Fringe Projection 3D Profile Measurement and Reflectometer Technology for Semiconductor Wafers

Technology Overview

Fringe Projection 3D Profile Measurement and Reflectometer Technology for Semiconductor Wafers.
Fringe Projection 3D Profile Measurement and Reflectometer Technology for Semiconductor Wafers.

In the manufacturing of silicon wafers, printed circuit boards and flat panel displays, the measurement of three-dimensional information is rapidly gaining importance. ITRI has developed a 3D telecentric measurement system based on fringe projection techniques to measure the absolute phase corresponding to the 3D shape of a surface with microbumps. The system uses reflectometer technology to correct the thickness of the thin film to construct a real bump height map. ITRI also developed a micro-telecentric 3D measurement system, which can increase the magnification from 0.75x to 10x enabling resolution of bump heights as low as 3 μm. This system uses a novel measurement algorithm based on an area scan camera with a flexibly programmable region of interest (ROI) to increase measurement speed. This fringe projecting system with selectable fringe density and adjustable projecting angles has been verified to flexibly and optimally introduce the phase-shifting algorithm to production-line bump measurement for a wide range of heights (3–160 μm) and 0.3 μm measurement accuracy, enabling it to meet future market needs for advanced packaging.

Applications & Benefits

This fringe projecting system with selectable fringe density and adjustable projecting angles has been verified to flexibly and optimally introduce the phase-shifting algorithm to production-line bump measurement for a wide range of heights (3–160 μm) and 0.3 μm measurement accuracy, enabling it to meet future market needs for advanced packaging.