Technology Overview
Online Wafer-Level High Aspect Ratio TSV Inspection Technology.
ITRI has developed a high-aspect ratio (>30) TSV inspection technology, distinguishing itself from traditional optical inspection methods that are limited to aspect ratios below 10. The Online Wafer-Level High Aspect Ratio TSV Inspection Technology, utilizing Separated Aperture Interference Technology (SNAIT), is non-destructive and does not require a vacuum system environment.
Applications & Benefits
It fills a critical technological gap in advanced IC packaging and inspection, accelerating process inspection feedback and ensuring process yield.