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Industrial Technology Research Institute

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Thermal Solutions for HPC Cooling

Thermal Solutions for HPC Cooling.
Thermal Solutions for HPC Cooling.

Technology Overview

  • 1000W vapor chamber (VC) components development.
  • Two-phase immersion cooling demonstration system development.
  • ITRI-Intel joint laboratory for single-phase immersion cooling development and certification.

Applications & Benefits

  • To address the kilowatt-level heat dissipation bottleneck on the HPC chip side, a wide range of optimized cooling technologies are being developed. This effort is geared towards expediting the practical implementation of the HPC industry while proactively establishing domestic technological leadership.
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