Technology Overview
3D Automated Optical Inspection Technology
Existing high-precision 3D module measurement systems often suffer from an insufficient field of view, compromising accuracy during the online inspection of wide-field products. ITRI’s 3D automated optical inspection technology overcomes this limitation. By utilizing innovative array-based multi-lens sensing technology and MEMS composite optical processes, this 3D sensing solution offers four times the field of view. Coupled with this technology is ITRI’s autonomous anti-interference image analysis technology, which incorporates adaptive skew correction and waveform anti-interference restoration optimization. This combination improves 3D accuracy to 20 nm and reduces inspection time.
Applications & Benefits
This innovation finds application in chip packaging inspection for 5G chips, electric vehicles, HPC, and other semiconductor applications. It enhances the value proposition of advanced packaging inspection equipment across the supply chain.