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Industrial Technology Research Institute

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Display Technology Center

Process and Validation Services

  • Gas Barrier / Encapsulation Process for AMOLED
  • TFT Processes (a-Si, Metal Oxide, LTPS)
  • Roll-to-Roll Process
  • Color OLED Process
  • CF Process: Color Filter fabrication (including photo resist material verification, coating, exposure, development, thickness measurement and color performance measurement)
  • Substrate Coating Process
  • Slot Die Coating Process
  • Dip Coating Process
  • Screen Printing Process
  • Ink-Jet Printing
  • Electro and Optical Performance Measurement: contrast, brightness, viewing angle, color gamma, response time, and reflectivity

Display Materials Verification Services

  • Flexible Substrate Materials (e.g. High Temp Polyimide, Transparent Polyimide)
  • OLED Associated Materials
  • Sputtering Target
  • CVD Precursor
  • Photolithography Process Materials
  • Barrier Films
  • Transparent Conductive Materials

Generation 2.5 Display Pilot Laboratory

  • Substrate Size: 370×470 mm2
  • Clean Room: 3,124 m2

TFT Process Platform

Process

Equipment

Function

Spec. / Features

Thin Film Deposition

PVD

Multi-chamber Sputtering
  • Film uniformity < 6%
  • Al, Ti, MoW, ITO, Metal oxide

CVD

Multi-chamber

PECVD
  • Film uniformity < 6%
  • a-Si, uCSi, SiNX, SiOX, N+ a-Si
  • Process Temperature≧150oC

Photo Exposure

Exposure

Stepper type
  • Resolution = 1μm
  • Spacing 4μm

Etcher

Dry Etcher

Dry etching
  • Metal
  • Dielectric

Wet Etcher

Wet etching
  • SiOx & SiN
  • Photoresist

OLED Process Platform

Process

Equipment

Function

Spec. / Features

OLED Deposition

OLED Deposition System
(Thermal Deposition/PVD)
  • Bottom or Top Emission OLED
  • Side by Side Full Color OLED
  • White OLED

Film Thickness Uniformity ≦ 5%
Process Temperature ≦80℃
Alignment Accuracy ± 5μm

Resolution:
FMM RGB>300 ppi 
WOLED+CF>300 ppi

Thin Film Passivation

PECVD/Polymer CVD/Flip

Inorganic/Organic Multi-Chamber PECVD

Film Thickness Uniformity ≦ 15%
Process Temperature ≦ 100℃

Encapsulation

Dam & Fill/VAS

Flexible OLED Cover Encapsulation

Alignment Accuracy ± 5μm